Apple Planning Bezel-Free iPhone With 'Four-Sided Bending' Display [Report]

Apple is preparing a major redesign of the iPhone to mark its 20th anniversary in 2027, according to a new report from South Korea's ETNews. One of the standout features in development is a "four-sided bending" display that could finally deliver a true bezel-less experience.The display would curve around all four edges of the device, creating a seamless, all-screen front. This lines up with previous reports suggesting Apple is working toward a futuristic iPhone design for 2027, potentially featuring a display "without any cutouts." To achieve that, Apple would likely need to implement an under-display camera (UDC) and sensor array—technologies the company has been steadily developing.To support this next-generation display, Apple is also said to be overhauling its display driver IC (DDI). The report notes a planned shift from the current 28nm planar process to a more advanced 16nm FinFET process. The primary goal is to reduce power consumption, which has become increasingly important as on-device AI features grow. This focus on efficiency, paired with the new DDI, could enable "a completely new display design not seen before," the report adds.Continue ReadingShare Article:Facebook, Twitter, LinkedIn, Reddit, EmailFollow iClarified:Facebook, Twitter, LinkedIn, Newsletter, App Store, YouTube

May 14, 2025 - 16:08

Apple Planning Bezel-Free iPhone With 'Four-Sided Bending' Display [Report]

Apple is preparing a major redesign of the iPhone to mark its 20th anniversary in 2027, according to a new report from South Korea's ETNews. One of the standout features in development is a "four-sided bending" display that could finally deliver a true bezel-less experience.

The display would curve around all four edges of the device, creating a seamless, all-screen front. This lines up with previous reports suggesting Apple is working toward a futuristic iPhone design for 2027, potentially featuring a display "without any cutouts." To achieve that, Apple would likely need to implement an under-display camera (UDC) and sensor array—technologies the company has been steadily developing.

To support this next-generation display, Apple is also said to be overhauling its display driver IC (DDI). The report notes a planned shift from the current 28nm planar process to a more advanced 16nm FinFET process. The primary goal is to reduce power consumption, which has become increasingly important as on-device AI features grow. This focus on efficiency, paired with the new DDI, could enable "a completely new display design not seen before," the report adds.

Continue Reading

Share Article:
Facebook, Twitter, LinkedIn, Reddit, Email

Follow iClarified:
Facebook, Twitter, LinkedIn, Newsletter, App Store, YouTube