Apple's 20th Anniversary iPhone May Feature Bezel-Free Display, AI Memory, Silicon Anode Battery [Report]

A new report from South Korea's ETNews is offering an early look at the technologies Apple may be planning for its 20th-anniversary iPhone, expected in 2027. The report highlights several key areas under development, including advanced memory for on-device AI, a true full-screen display, next-generation display driver ICs, and a potential leap in battery technology.One of the most notable upgrades could be the adoption of 'mobile HBM' (High Bandwidth Memory), also known as LLW (Low Latency Wide I/O) DRAM. This technology stacks low-power DRAM to deliver much higher bandwidth, a feature that would significantly boost on-device AI performance when paired with the iPhone's GPU. According to ETNews, Apple is considering the memory for its 2027 iPhone and has reportedly been in discussions with major suppliers such as Samsung and SK Hynix, who are aiming to begin mass production of mobile HBM packages after 2026.Apple may also finally achieve a true full-screen experience. The company is said to be developing Under-Display Camera (UDC) technology that would hide the front-facing camera beneath the display. Overcoming the challenges of light transmission and image quality is a focus, with materials like transparent polyimide and specialized lenses reportedly under consideration. Additionally, Apple may adopt a four-sided curved OLED panel to eliminate bezels entirely. This would build on previous techniques to shrink the display's chin and aligns with earlier reports that the 2027 iPhone could feature a screen without any cutouts. Under-display Face ID is also in development, possibly enabling a completely uninterrupted screen on future Pro models.Continue ReadingShare Article:Facebook, Twitter, LinkedIn, Reddit, EmailFollow iClarified:Facebook, Twitter, LinkedIn, Newsletter, App Store, YouTube

May 14, 2025 - 18:22

Apple's 20th Anniversary iPhone May Feature Bezel-Free Display, AI Memory, Silicon Anode Battery [Report]

A new report from South Korea's ETNews is offering an early look at the technologies Apple may be planning for its 20th-anniversary iPhone, expected in 2027. The report highlights several key areas under development, including advanced memory for on-device AI, a true full-screen display, next-generation display driver ICs, and a potential leap in battery technology.

One of the most notable upgrades could be the adoption of 'mobile HBM' (High Bandwidth Memory), also known as LLW (Low Latency Wide I/O) DRAM. This technology stacks low-power DRAM to deliver much higher bandwidth, a feature that would significantly boost on-device AI performance when paired with the iPhone's GPU. According to ETNews, Apple is considering the memory for its 2027 iPhone and has reportedly been in discussions with major suppliers such as Samsung and SK Hynix, who are aiming to begin mass production of mobile HBM packages after 2026.

Apple may also finally achieve a true full-screen experience. The company is said to be developing Under-Display Camera (UDC) technology that would hide the front-facing camera beneath the display. Overcoming the challenges of light transmission and image quality is a focus, with materials like transparent polyimide and specialized lenses reportedly under consideration. Additionally, Apple may adopt a four-sided curved OLED panel to eliminate bezels entirely. This would build on previous techniques to shrink the display's chin and aligns with earlier reports that the 2027 iPhone could feature a screen without any cutouts. Under-display Face ID is also in development, possibly enabling a completely uninterrupted screen on future Pro models.

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